Process and apparatus for bonding particulate material, in...

Details Process and apparatus for bonding particulate material, in... Process and apparatus for bonding particulate material, in...

B - Operations, Transporting

27

N

32/28, 117/46.3

B27N 1/02 (2006.01) B01J 13/02 (2006.01)

Patent

CA 1192796

ABSTRACT OF THE DISCLOSURE For achieving optimum application of bonding agent to particulatematerial, in particular chips, with- out elaborate plant and machinery, it is proposed to carry out the application of bonding agent using a pneumatic conveyor device for material which is in any case present, by arranging at least one spray nozzle for bonding agent in at least one section of the pipes of the material transport device and spraying the par- ticles which are transported in the form of a film, using this spray nozzle for bonding agent.

413901

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