Process and apparatus for direct extrusion of thermal...

B - Operations – Transporting – 29 – C

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B29C 47/02 (2006.01) B29C 39/18 (2006.01) E06B 3/267 (2006.01)

Patent

CA 1222112

- 25 - ABSTRACT OF THE DISCLOSURE: A process and apparatus for direct extrusion of thermal barrier profiles is disclosed. The process comprises the steps of providing an elongated structural member having a lineal cavity therein with an open portion, driving the elongated member past a filling die while simultaneously guiding the elongated member so as to positively locate the open portion of the lineal cavity with respect to the filling die in order to completely close the cavity at the location of the filling die, continuously extruding thermoplastic along the cavity through a fluid flow passage in the filling die, and removing a lineal portion of the structural member opposite to the open portion of the lineal cavity to form the thermal barrier profile. The process may also be used to construct a composite thermal barrier profile by providing two separate elongated structural members having portions facing and spaced from each other to form a lineal cavity with opposite open portions, driving the elongated members past a filling die while simultaneously guiding the elongated members so as to positively locate the open portions of the lineal cavity with respect to corresponding portions of the filling die in order to completely close the cavity at the location of the filling die, and continu- ously extruding thermoplastic material along the cavity through a fluid flow passage in the filling die.

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