Process and apparatus for etching copper masked by a...

Details Process and apparatus for etching copper masked by a... Process and apparatus for etching copper masked by a...

H - Electricity

05

K

356/12, 356/22,

H05K 3/06 (2006.01) C23F 1/02 (2006.01)

Patent

CA 1223082

ABSTRACT Process and apparatus for anisotropically etching copper through a nickel-gold mask on a circuit board. An electrical connection is made between the copper and the reactor wall or another electrical conductor contacted by the etching solution. The copper is removed anisotropically, without undercutting so lateral etching of the copper beneath the nickel-gold mask

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