Process and apparatus for free polishing

Details Process and apparatus for free polishing Process and apparatus for free polishing

B - Operations, Transporting

24

B

51/54

B24B 29/00 (2006.01) B24B 37/00 (2006.01) B24D 13/14 (2006.01)

Patent

CA 1106611

PROCESS AND APPARATUS FOR FREE POLISHING Abstract Opposite faces of a workpiece, such as a semiconductor wafer, are simultaneously free polished by contacting the faces with a pair of rotating polishing pads to which are fed a polishing slurry of an abrasive ma- terial. A pattern of perforations is provided in the surface of at least one of the pads such that the area of pad in contact with the opposite faces of the work- piece is different. FI 9-78-031

331675

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