B - Operations – Transporting – 05 – D
Patent
B - Operations, Transporting
05
D
117/104, 204/109
B05D 1/42 (2006.01) B05C 11/02 (2006.01) H01L 21/48 (2006.01) H01L 21/56 (2006.01) H01L 23/31 (2006.01)
Patent
CA 2010219
Abstract of the Disclosure A process and an apparatus for the planarizing of rough, structured or heterogeneous surfaces with a leveling layer. A cover layer permeable to energy radiation is laminated by means of a film pressing device, which comprises a sliding shoe and a feed device, on to a substrate base bearing the surface to be planarized. During lamination, the contact zone between the film pressing device and the substrate base forms a tapering laminating nip, which is constantly supplied with the organic coating material forming a film or layer.
Haas Raimund
Hierholzer Bernhard
Spiess Wolfgang
Fetherstonhaugh & Co.
Haas Raimund
Hierholzer Bernhard
Hoechst Aktiengesellschaft
Spiess Wolfgang
LandOfFree
Process and apparatus for the planarizing of rough,... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process and apparatus for the planarizing of rough,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process and apparatus for the planarizing of rough,... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1809051