C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
C25D 7/00 (2006.01) C25D 5/00 (2006.01) H05K 3/42 (2006.01)
Patent
CA 2105078
ABSTRACT OF THE DISCLOSURE In a process for electroplating workpieces (1) with perforations (2), the workpiece to be treated is located between a first anode (3) and a second anode (4). To obtain a more advantageous ratio of the thickness of the layer of a material on the outer surfaces of the workpiece to the thickness of the layer of material on the inner walls of the perforations, i.e., a ratio approaching 1:1, a positive potential is applied alternately to the first anode (3) and the second anode (4), while a constant negative voltage with respect to the active anode is applied to the workpiece (1) to be treated, which forms the cathode. Arrangements for carrying out his process, for example using an electroplating rectifier (6), the negative side (7) of which is connected to the workpiece (1) and the positive side (8) of which is connected to the input of a reversing switch (10), are also disclosed. The output of the reversing switch is optionally connected to a lead (12) or (13) to the first anode (3) or to the second anode (4).
Geigulat Matthias
Schneider Reinhard
Atotech Deutschland Gmbh
Riches Mckenzie & Herbert Llp
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