Process and circuit arrangement for testing solder joints

G - Physics – 01 – N

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G01N 23/04 (2006.01) H05K 13/08 (2006.01)

Patent

CA 2236845

The invention concerns a process and circuit arrangement for testing solder joints, preferably on printed circuit boards, whereby the quality of the solder joints is examined for defects using X-rays and qualitative information on the individual solder joints is obtained. According to the invention, the qualitative and/or the measured values of the individual solder joints that characterise the measured physical parameters of the tested solder joints, are used to control the manufacture of further solder joints in the production process in which solder joints are tested.

L'invention concerne un procédé et une circuiterie pour tester des brasures réalisées, de préférence, sur des cartes de circuits imprimés. La qualité des brasures est contrôlée par détection des défauts au moyen d'un rayonnement X, ce qui permet d'obtenir des informations sur la qualité des différentes brasures. Selon l'invention, on utilise les informations relatives à la qualité et/ou aux valeurs mesurées des différentes brasures, qui caractérisent les paramètres physiques mesurés des brasures testées, pour contrôler la fabrication d'autres brasures dans le processus de production au cours duquel les brasures sont testées.

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