Process and device for cutting a multilayer assembly formed...

Details Process and device for cutting a multilayer assembly formed... Process and device for cutting a multilayer assembly formed...

B - Operations, Transporting

23

K

B23K 26/00 (2006.01) B23K 26/12 (2006.01) B23K 26/40 (2006.01) H01M 6/18 (2006.01)

Patent

CA 2049328

At leat one laser beam is focused on one side of the assembly (10) to be cut at a point (4) on said side which is part of the cutting profile and which is called the point of impact of said beam on said side, in order to cause at that point a disintegration of the material of said assembly. The laser beam is moved (11, 12) in relation to said assembly so that the impact point (4) describes a trajectory which corresponds to the desired cutting profile, while maintaining a controlled atmosphere (15) in the area around said impact point. Uses particularly include cutting solid polymer electrolyte lithium thin film electrochemical generators, or cutting precursors of such generators.

On focalise au moins un faisceau laser sur l'une des faces de l'ensemble (10) à découper, en un point (4) de cette face ap- partenant au profil de découpe et appelé point d'impact dudit faisceau sur ladite face, de manière à produire en ce point une dés- intégration de la matière dudit ensemble et l'on anime le faisceau laser d'un mouvement relatif (11, 12) par rapport à l'ensemble à découper de telle sorte que ledit point (4) d'impact décrive une trajectoire correspondant au profil de découpe à réaliser, tout en maintenant une atmosphère contrôlée (15) dans une zone autour de ce point d'impact. Application, en particulier, à la découpe de générateurs électrochimiques en couches minces au lithium à électrolyte solide polymère ou de précurseurs de tels générateurs.

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