B - Operations – Transporting – 29 – C
Patent
B - Operations, Transporting
29
C
B29C 45/14 (2006.01)
Patent
CA 2268328
In a method of encapsulating the edges of thin-walled plates (1), in particular made of breakable materials, such as glass or ceramic, by means of an apparatus having two mold halves (3, 4) which can be moved toward each other and between which the edges are securely held, the two mold halves (3, 4) are firstly moved toward each other under essentially maximum bonding pressure, the edges of the plate (1) being taken up but not loaded, and, after reaching the maximum bonding pressure, an internal sealing cushion (8) is pressed against the plate (1) with a pressure corresponding to the material of the plate (1). As a result, the maximum bonding pressure of the two mold halves (3, 4) can be hundreds of tonnes, but the plate (1) is nevertheless not damaged. On the other hand, by appropriate setting of the pressure of the sealing cushion (8), oozing out of the injected plastic from the mold cavity (5) can be reliably avoided.
Barth Georg
Barth Roland
Gbm Kunststofftechnik Und Formenbau Gmbh
Robic
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