C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
C23C 18/40 (2006.01) C23C 18/16 (2006.01)
Patent
CA 2052931
501-175 PROCESS AND PROGRAMMABLE COMPUTER CONTROLLED SYSTEM FOR ELECTROLESS COPPER PLATING ABSTRACT OF THE DISCLOSURE A process is provided for maintaining the level of cyanide ion stabilizer in an electroless copper plating bath held at a constant predetermined temperature by making additions of predetermined amounts of cyanide ion feedstock at predetermined time intervals. The properties of the copper layer deposited on a substrate by means of the system are significantly improved in uniformity and structural strength. In addition, The plating rate and stability of the bath are far more uniform. A programmable computer system for controlling the process of the invention is also described.
Macdermid Incorporated
Martin Theodore A. Jr.
Perley-Robertson Hill & Mcdougall Llp
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