Process for adhesion-bonding between metallic materials and...

C - Chemistry – Metallurgy – 25 – D

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204/23.5

C25D 3/02 (2006.01) C25D 5/10 (2006.01)

Patent

CA 1337690

Disclosed are electrolytes and processes for the metal-plating of metallic materials, and more specific- ally low-alloy high-strength steels, which processes are characterized in that adhesion-bonding layers of iron, iron and nickel, nickel, cobalt, copper or alloys of said metals or Sn-Ni alloys are electrodeposited on said metallic materials from non-aqueous electrolytes, and then aluminum is electrodeposited thereon in a per se known manner.

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