H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/6
H05K 3/10 (2006.01) H05K 3/24 (2006.01) H05K 3/46 (2006.01) H05K 1/09 (2006.01) H05K 3/34 (2006.01) H05K 3/40 (2006.01)
Patent
CA 1249064
PROCESS FOR APPLICATION OF OVERLAY CONDUCTORS TO SURFACE OF PRINTED CIRCUIT BOARD ASSEMBLIES Abstract of the Disclosure The invention provides a method of applying an overlay conductor between at least a pair of connection land areas on a surface of a printed circuit board. The pattern of the conductor is first defined by the application of a dielectric material between the pair of land areas. A silver polymer ink is then applied over the dielectric material and over only a portion of each land area. The polymer ink is then cured by exposure to a source of heat. The pair of land areas and at least the portion of the cured ink overlaying the land areas are then covered with silver solder paste which is subsequently reflowed by exposure to a source of heat and allowed to solidify thereby attaching the conductor to the land area and providing a secure conductive connection. - i -
541394
Bennett Reginald B.p.
Drake Allan R.
Finn Roger C.
Na
Nortel Networks Limited
LandOfFree
Process for application of overlay conductors to surface of... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process for application of overlay conductors to surface of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for application of overlay conductors to surface of... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1186671