Process for applying or removing materials

Details Process for applying or removing materials Process for applying or removing materials

B - Operations, Transporting

82

B

B82B 3/00 (2006.01) G01Q 30/12 (2010.01) G03F 7/20 (2006.01) G11B 9/14 (2006.01)

Patent

CA 2299374

Disclosed is a method for efficient material application onto substrates or removal therefrom, whereby a scanning probe microscope working under atmospheric pressure is used. According to the inventive method, the substrate is placed in a vessel, which is located on the x-y support of a scanning probe microscope (SXM) and filled with a liquid or gas medium up to a level where the top face of the substrate is covered with a thin layer consisting of at least one monolayer of said medium. In order to cause the medium to produce a structured deposit, or to attack the substrate surface in a structured manner, the microtip of the scanning probe microscope is then dipped into the layer while electric voltage or voltage pulses are applied. The inventive method can be used to apply material onto substrates or remove it therefrom. It can also be used to characterize the geometry of microtips, renew or produce microtips for SXM consoles and to record, read out and erase information.

L'invention concerne un procédé permettant d'appliquer des matériaux sur des substrats ou de les y éliminer efficacement, en utilisant un microscope sonde à balayage fonctionnant sous pression atmosphérique. Dans le procédé selon l'invention, on place le substrat dans une cuve qui se trouve sur le support x-y d'un microscope sonde à balayage (SXM) et qu'on remplit d'un milieu liquide ou gazeux jusqu'à un niveau tel que la face supérieure du substrat est recouverte d'une couche mince, constituée d'au moins une monocouche du milieu. Afin de déposer un dépôt structuré provenant du milieu ou d'attaquer la surface du substrat de manière structurée, on plonge ensuite la micropointe du microscope sonde à balayage dans la couche et on applique une tension électrique ou des impulsions de tension. Le procédé selon l'invention peut servir à appliquer des matériaux sur des substrats ou à les y éliminer. On peut également l'utiliser pour caractériser la géométrie de micropointes et pour renouveler ou produire des micropointes de consoles SXM, ainsi que pour enregistrer, lire et effacer des informations.

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