Process for assembling electronics using microwave irradiation

Details Process for assembling electronics using microwave irradiation Process for assembling electronics using microwave irradiation

H - Electricity

05

K

H05K 13/04 (2006.01) H05B 6/80 (2006.01) H05K 3/30 (2006.01) H05K 3/34 (2006.01) H05K 3/32 (2006.01)

Patent

CA 2222703

The present invention provides a process for assembling electronics which allows for rapid heating and fast curing, and avoids subjecting the components to potentially damaging cure conditions. The process includes applying conductive or non-conductive curable thermoplastic or thermosetting resins, having adhesive properties, to a surface of the substrate or electrical component or both. One or more electrical components may be mounted on the substrate using the adhesive properties of the resin. The resin is then subjected to variable frequency microwave irradiation selected to cure the resin without adversely affecting the substrate or electrical components.

Cette invention concerne un procédé d'assemblage d'un dispositif électronique qui permet d'effectuer un chauffage et un durcissement rapides tout en évitant de soumettre les composants à des conditions de durcissement potentiellement dégradantes. Le procédé consiste à appliquer des résines durcissables thermoplastiques ou thermodurcissables conductrices ou non conductrices, possédant des propriétés adhésives, sur une surface du substrat ou d'un composant électrique ou encore sur les deux. Au moins un composant électrique peut être monté sur le substrat grâce aux propriétés adhésives de la résine. On soumet ensuite la résine au rayonnement des ondes ultracourtes à fréquence variable sélectionné pour durcir la résine sans endommager le substrat ou les composants électriques.

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