Process for avoiding blister formation in electroless...

Details Process for avoiding blister formation in electroless... Process for avoiding blister formation in electroless...

C - Chemistry, Metallurgy

04

B

117/77

C04B 41/51 (2006.01) C23C 18/18 (2006.01) H05K 1/03 (2006.01) H05K 3/18 (2006.01) H05K 3/38 (2006.01)

Patent

CA 1247466

ABSTRACT A process for avoiding blister formation between a metal layer which is electrolessly deposited on a surface of a ceramic substrate and the substrate. The substrate is adhesion promoted with an alkali metal composition containing between 0.35 and 0.9 mole fraction alkali metal compound, and water in an amount which is sufficient to lower the melting temperature of the composition to between 145° and 240°C and adhesion promote the ceramic surface with the molten composition in a time period between 1 and 200 minutes. Thereafter, the adhesion promoted ceramic surface may be activated to render it receptive to electroless metal deposition. The treated ceramic surface is coated free of blisters using an electroless metal deposition bath with an adherent, metal layer having a thickness greater than 5 micrometers.

497175

Affiliated with

Also associated with

Rating

Process for avoiding blister formation in electroless... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for avoiding blister formation in electroless..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for avoiding blister formation in electroless... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1302342