B - Operations – Transporting – 23 – P
Patent
B - Operations, Transporting
23
P
B23P 5/00 (2006.01) C04B 37/02 (2006.01) H01L 23/373 (2006.01)
Patent
CA 2217790
This invention involves a bonding process for mounting a diamond substrate on at least one metal substrate, as follows: at least one face of the diamond substrate is covered with aluminum foil. The diamond substrate and aluminum foil are placed in a controlled-atmosphere chamber and are bonded together in an initial Argon or vacuum thermo-compression stage, thus producing a multilayer composite substrate. This multilayer composite substrate is laid upon a metal substrate with the aluminum surface in contact with the metal substrate. The multilayer composite substrate and the metal substrate are then bonded together by a second stage of thermo-compression.
l'invention concerne un procédé de liaison d'un substrat de diamant à au moins un substrat métallique, selon l'invention : au moins une face du substrat de diamant est recouverte par une feuille d'aluminium; ledit substrat de diamant et ladite feuille d'aluminium sont disposés dans une enceinte à atmosphère contrôlée et sont liés ensemble par une première étape de thermo-compression sous Argon ou sous vide, réalisant ainsi un substrat multicouche composite; ledit substrat multicouche composite est disposé sur un substrat métallique, la surface en aluminium au contact du substrat métallique; et ledit substrat multicouche composite et ledit substrat métallique sont liés par une deuxième étape de thermo-compression.
Petitbon Alain
Ranchy Eric
Alcatel
Alcatel Alsthom Compagnie Generale D'electricite
Robic
LandOfFree
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