Process for bonding inorganic materials

Details Process for bonding inorganic materials Process for bonding inorganic materials

C - Chemistry, Metallurgy

04

B

400/4106, 400/53

C04B 41/49 (2006.01)

Patent

CA 1128685

ABSTRACT OF THE DISCLOSURE A composition and process-are provided for bonding inorganic materials. The composition is a water-free composition comprising a bis(trialkoxysilyl)alkane and a hydrolysis catalyst. The process includes contacting the inorganic materials with an alkoxy-containing silicon com- pound in which at least a portion of the alkoxy-containing silicon com- pound is a bis(trialkoxysilyl)alkane in the presence of a hydrolysis catalyst, and then allowing hydrolysis in the presence of water. This process imparts hydrophobic properties to bonded inorganic materials, and also improves the strength of such bonded inorganic materials.

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