Process for boriding metals and metal alloys by means of...

Details Process for boriding metals and metal alloys by means of... Process for boriding metals and metal alloys by means of...

C - Chemistry, Metallurgy

23

C

148/13

C23C 8/68 (2006.01) C23C 8/70 (2006.01)

Patent

CA 1230804

ABSTRACT OF THE DISCLOSURE A process is provided for bonding metals and metal alloys in a fluidized bed at a temperature of from about 580° to about 1300°C. As a boriding agent, there was used a granular material comprising essentially spherical particles having a particle size of from about 0.025 to about 5.00 mm, which granular material was manufactured by spray drying a preferably aqueous suspension or dispersion based on materials that yield boron, and which can contain fillers, extenders and binders.

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