Process for brazing metallized components to ceramic substrates

Details Process for brazing metallized components to ceramic substrates Process for brazing metallized components to ceramic substrates

B - Operations, Transporting

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B23K 1/00 (2006.01) C04B 37/00 (2006.01) C04B 37/02 (2006.01) H01L 21/48 (2006.01) H01L 21/60 (2006.01) H01L 23/498 (2006.01) H05K 1/09 (2006.01) H05K 3/24 (2006.01) H05K 3/38 (2006.01)

Patent

CA 2039205

-25- ABSTRACT A process for brazing a metallized component to a metallized ceramic-based substrate comprising the steps of: a) applying a second conductor composition over the metallizations on the substrate such that the metallizations are covered by said second conductor composition which consists essentially of a metal powder and an organic medium; b) drying said second conductor composition; c) firing said second conductor composition at a temperature sufficient to sinter the metal powder of the second conductor composition and drive off said organic medium thereby forming a second metallization layer; d) forming an assembly by positioning at least one metallized component on said second metallization layer and a brazing composition at the component-second metallization layer interface; and e) heating said assembly at a temperature sufficient for said brazing composition to form a joint between said component and said second metallization layer. -25-

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