Process for carrying out the soldering of electronic...

Details Process for carrying out the soldering of electronic... Process for carrying out the soldering of electronic...

B - Operations, Transporting

23

K

113/89

B23K 31/02 (2006.01) B23K 35/36 (2006.01) H05K 3/34 (2006.01)

Patent

CA 1276841

PROCESS FOR CARRYING OUT THE SOLDERING OF ELECTRONIC COMPONENTS ON A SUPPORT (Case T. 3369) ABSTRACT OF THE DISCLOSURE Electronic components are welded or soldered to a support by arranging said components on the surface of the support and/or in holes piercing the support, in the presence of soldering materials having binding properties, and by then putting the thus-obtained assembly in contact with a perfluoropolyether in the liquid state, said perfluoropolyether having a temperature at least equal to that at which the soldering material develops its binding properties.

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