C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
C23C 18/18 (2006.01) C23C 18/20 (2006.01) C23C 18/22 (2006.01) C23C 18/30 (2006.01) F02B 75/02 (2006.01) H05K 3/18 (2006.01) H05K 3/38 (2006.01)
Patent
CA 2142683
There is disclosed a novel process for catalyzation for trapping of a catalyst metal involved with the adhesion of an electroless plating to a substrate. The process is carried out by employing neither the sensitizing-activating method nor the catalyst- accelerator method. Specifically, in forming an electroless plating on the surface of a non-conductive substance as a substrate, the surface of the non-conductive substance is coated with a treatment liquid containing at least chitosan or a chitosan derivative before the steps of catalyzation and electroless plating to form a hydrophilic coating film on the surface of the non-conductive substance. The hydrophilic coating film traps and fixes thereon a catalyst metal such as palladium through chemisorption thereof by the action of chitosan or the chitosan derivative. As a result, a state that a sufficient amount of the active catalyst is borne on the surface of the substrate can be secured in the step of electroless plating to enable the electorless plating strong in adhesion to the substrate to be uniformly and efficiently formed on the surface of the substrate.
Omura Yoshihiko
Daishin Chemical Co. Ltd.
Marks & Clerk
Omura Yoshihiko
Omura Toryo Co. Ltd.
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