Process for cementing semiconductor discs to carrier plates...

Details Process for cementing semiconductor discs to carrier plates... Process for cementing semiconductor discs to carrier plates...

B - Operations, Transporting

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154/107, 154/72.

B01D 5/00 (2006.01) H01L 21/00 (2006.01) H01L 21/302 (2006.01) H01L 21/673 (2006.01)

Patent

CA 1075579

ABSTRACT OF THE DISCLOSURE Process for cementing semiconductor discs to a carrier plate for subsequent polishing, which comprises applying to the discs a cementing solution being composed of a) a resin of a melting range between 50 and 100°C and a melt viscosity between 1000 and 6000 P; b) a substance acting as plasticizer for the resin at cementing temperatures and c) a solvent for the resin and the plasticizer, which evap- orises at cementing temperatures, while avoiding during the application the occlusion of air bubbles between discs and cementing layer, and exerting pressure onto the plates at a temperature between cementing temperature and 30°C below the same. The invention also comprises the carrier plate carrying one or more discs cemented there to by the above process.

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