Process for chemical-mechanical polishing of iii-v...

H - Electricity – 01 – L

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H01L 21/304 (2006.01) H01L 21/306 (2006.01)

Patent

CA 1044580

PROCESS FOR CHEMICAL-MECHANICAL POLISHING OF III - V SEMICONDUCTOR MATERIALS ABSTRACT OF THE DISCLOSURE Method for combined chemical-mechanical polishing of III - V semiconductor planar surfaces by applying a weak aqueous hydro- chloric acid solution in combination with an aqueous source of chlorine to the surface to be polished while simultaneously mechanically polishing the surface. -1-

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