H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 3/46 (2006.01) H01L 23/538 (2006.01) H05K 3/00 (2006.01) H05K 3/28 (2006.01) B32B 35/00 (1990.01)
Patent
CA 2138218
The present invention relates to a process for delaminating an organic resin insulation layer from a board without adversely affecting the organic resin multi-layer wiring layer therefor and to a process for manufacturing an organic resin multi-layer wiring board. A polyimide insulation layer is formed on a quartz glass board. Another polyimide insulation layer and a wiring layer, which together with the polyimide insulation layer form a first block, are laminated on the polyimide insulation layer. The back of the quartz glass board is irradiated with an excimer laser to delaminate the first block and the quartz glass board. Ultraviolet rays from the excimer laser react with the polyimide insulation layer in a photochemical reaction which removes the polyimide insulation layer located at the interface with the quartz glass board and delaminates the quartz glass board from the first block.
Hasegawa Shinichi
Ishida Hisashi
Tamura Koetsu
Tanaka Shinji
Corporation Nec
G. Ronald Bell & Associates
LandOfFree
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