Process for depositing a conducting metal layer on an...

H - Electricity – 05 – K

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356/12

H05K 3/06 (2006.01)

Patent

CA 1103810

ABSTRACT OF THE DISCLOSURE: A method of manufacturing a pattern of electro-conductive metal deposited on an enameled substrate which comprises applying an ink composition to the enameled substrate in accordance with the pattern, the ink composition comprising a second enamel and a metal-containing powder receptive to electroless plating, the second enamel having a melting point no greater than the soften- ing point of the enamel of the enameled substrate and the metal- containing powder being present in an amount sufficient to pro- vide from 60 to 90% by weight of the ink composition after baking; baking the composition; treating the baked composition so as to expose particles of the metal containing powder; and subjecting the baked, exposed composition to electroless plating.

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