C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
C23C 14/16 (2006.01) C23C 14/14 (2006.01) C30B 23/02 (2006.01)
Patent
CA 2662734
The present invention relates to a process for depositing a thin film of a metal alloy on a substrate, said film comprising at least four components and said alloy being either: an amorphous alloy containing at least 50 at% of the elements Ti and Zr, or a high-entropy alloy, the elements of which are chosen from the group consisting of Al, Co, Cr, Cu, Fe, Ni, Si, Mn, Mo, V, Zr and Ti; by simultaneous magnetron sputtering of at least two targets. The present invention also relates to a metal alloy in the form of a thin film comprising at least four components, which can be deposited on a substrate by implementing the process.
La présente invention concerne un procédé pour déposer sur un substrat une couche mince d'alliage métallique comprenant au moins quatre éléments, ledit alliage étant soit : un alliage amorphe contenant en pourcentage atomique au moins 50% des éléments Ti et Zr, soit un alliage à haute entropie dont les éléments sont choisis dans le groupe constitué par Al, Co, Cr, Cu, Fe, Ni, Si, Mn, Mo, V, Zr et Ti; par pulvérisation magnétron simultanée d'au moins deux cibles. La présente invention concerne également un alliage métallique sous forme de couche mince comprenant au moins quatre éléments, susceptibles d'être déposés sur un substrat par mise en oeuvre du procédé.
Brault Pascal
Gillon Pascale
Thomann Anne-Lise
Centre National de La Recherche Scientifique (cnrs)
Smart & Biggar
Universite D'orleans
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