Process for depositing conductive layers on substrates

H - Electricity – 01 – L

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356/182

H01L 21/283 (2006.01) H01L 21/48 (2006.01) H01L 23/498 (2006.01) H05K 3/10 (2006.01) H05K 3/38 (2006.01)

Patent

CA 1058330

PROCESS FOR DEPOSITING CONDUCTIVE LAYERS ON SUBSTRATES ABSTRACT OF DISCLOSURE A process is described for metallizing electronic circuit elements comprising vapor depositing a metal adhesion layer on a circuit substrate, vapor depositing a second metal layer having a good electrical conductivity on the adhesion layer, then oxidizing any of the adhesion layer material which is diffused through the second layer, and thereafter vapor depositing an additional layer of the good conductivity metal over the second layer and the oxidized material.

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