Process for desmearing and etching of plastics layers in...

Details Process for desmearing and etching of plastics layers in... Process for desmearing and etching of plastics layers in...

H - Electricity

05

K

149/12.1

H05K 3/26 (2006.01) H05K 3/00 (2006.01) H05K 3/38 (2006.01) H05K 3/18 (2006.01)

Patent

CA 1267826

A B S T R A C T The invention relates to a process for the reliable des- mearing and etching as well as crack-free roughening of plastic layers in holes drilled in basic material of printed circuit boards for highly adhesive metal-coating of the same with the use of sulfuric-acid solutions, characterized in that the holes are treated with a solution containing sulfuric acid and nitrate anions, the process being suitable for manufacturing printed circuit boards and/or through-plated circuit boards.

492324

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