H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 3/34 (2006.01) B23K 1/08 (2006.01)
Patent
CA 2083135
2083135 9119414 PCTABS00008 The invention relates to a process for making printed circuit boards with solder pads to be coated with solder which are first surrounded by a resist of given thickness preventing the adhesion of solder; the printed circuit board is then immersed in a solder bath in which the regions to be soldered are covered by a closure; when the printed circuit board is removed from the bath, the closure separates the volume of solder contained in it from the liquid solder in the bath or solder chamber, so that corresponding volumes of solder are defined in the hollow spaces above the solder pads. This has the advantage over the present state of the art that making the closure is simplified and the process of forming the solder pads can be performed separately from the actual dip-soldering procedure.
Friedrich Dieter
Friedrich Gitta
Jena Freidrich-Schiller-Universitat
Cassan Maclean
Friedrich Dieter
Friedrich Gitta
Jena Freidrich-Schiller-Universitat
LandOfFree
Process for dip-soldering printed circuit boards does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process for dip-soldering printed circuit boards, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for dip-soldering printed circuit boards will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1529340