Process for directly metallizing circuit boards

Details Process for directly metallizing circuit boards Process for directly metallizing circuit boards

C - Chemistry, Metallurgy

25

D

204/12.5

C25D 7/12 (2006.01) C08G 61/12 (2006.01) C25D 5/54 (2006.01) C25D 5/56 (2006.01) H05K 3/18 (2006.01)

Patent

CA 2025337

The present invention relates to a process for directly metallizing circuit boards, preferably in a horizontal throughput system, with the omission of electrolyte that requires no outside current. A multi-functional adsorption layer is produced selectively on the non-conductive parts of the circuit boards, said layer being able to adsorb an oxidation agent and/or store, this in pores or which is itself an oxidation agent, and which then is brought to reaction with such monomers as are suitable for the formation of conductive polymers, and which are metallized by electroplating.

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