Process for electrodepositing composite nickel layers

Details Process for electrodepositing composite nickel layers Process for electrodepositing composite nickel layers

C - Chemistry, Metallurgy

25

D

204/31

C25D 3/18 (2006.01) C25D 3/12 (2006.01) C25D 5/14 (2006.01) C25D 15/00 (2006.01)

Patent

CA 1255620

ABSTRACT OF THE DISCLOSURE An improved process for producing a composite nickel- containing electroplate on a substrate including an inner nickel-containing layer, of an average sulfur content of less than about 0.03 percent by weight, an intermediate nickel- containing layer of an average sulfur content of about 0.05 to about 0.5 percent by weight and an adjacent adherent outer nickel layer of an average sulfur content of about 0.02 to about 0.15 percent but less in sulfur than the intermediate layer and higher in sulfur than the inner layer. The controlled amount of sulfur is introduced into at least the intermediate layer by employing an aqueous acidic nickel solution containing a controlled amount of a thiazole and/or thiazoline additive compound so as to provide an intermediate nickel-containing deposit containing the specified average sulfur content.

460967

Affiliated with

Also associated with

Rating

Process for electrodepositing composite nickel layers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for electrodepositing composite nickel layers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for electrodepositing composite nickel layers will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1271743