Process for electrodepositing copper

Details Process for electrodepositing copper Process for electrodepositing copper

C - Chemistry, Metallurgy

25

D

204/36

C25D 3/38 (2006.01)

Patent

CA 1255622

Abstract of the Disclosure A process for electrodepositing a substantially uniformly hard, bright, leveled and ductile engineering copper plate on a conductive substrate, and particularly, on rotogravure printing cylinders, which copper deposit is further characterized as being substantially non-annealing thereby retaining its hardness for prolonged time periods following the electroplating step rendering the plate eminently suitable for mechanical engraving. The process employs an aqueous acidic copper electrolyte containing controlled amounts of a selected combination of organic brightening agents and the electrodeposition of the copper plate is performed under controlled processing conditions at a selected threshold current density to attain a copper deposit possessing the aforementioned beneficial characteristics. The combination of organic brightening agents includes an organic polyether compound, an organic sulfide compound, an apo safranine compound, a substituted phthalocyanine compound and an alkylated polyethyleneimine reaction product having a quaternary nitrogen.

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