Process for electroforming copper foil

Details Process for electroforming copper foil Process for electroforming copper foil

C - Chemistry, Metallurgy

25

D

204/9

C25D 1/04 (2006.01) C25D 3/38 (2006.01) H05K 3/02 (2006.01) H05K 3/38 (2006.01)

Patent

CA 1167406

ABSTRACT An improved copper electroforming method typically for use on a carrier material such as aluminum is provided by pretreating the carrier surface and electrodepositing copper foil utilizing a single-step copper deposition process comprising an acidic plating bath containing copper, nitrate at 3 to 50 g/1, and fluoride ions at 0.05 to 10 g/l which can be operated at a single-current density. The carrier material is advantageously provided with a parting layer.

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