Process for electroplating pt onto a substrate

Details Process for electroplating pt onto a substrate Process for electroplating pt onto a substrate

C - Chemistry, Metallurgy

25

D

204/26, 204/29.5

C25D 3/50 (2006.01) C25D 3/56 (2006.01) H05K 3/24 (2006.01)

Patent

CA 1339116

An effective method for plating platinum or platinum alloys onto substrates comprises using a dissolved tetrammine complexed platinum(II) salt, using specified anion components in alkaline aqueous solution at 90 to 95°C. The bath is more efficient and stable than known baths and permits good plating deposits to be achieved.

610461

Affiliated with

Also associated with

Rating

Process for electroplating pt onto a substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for electroplating pt onto a substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for electroplating pt onto a substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1190418