C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 101/00 (2006.01) B29C 45/14 (2006.01) C08L 81/06 (2006.01) H01B 3/30 (2006.01) H01B 3/40 (2006.01) H01L 23/28 (2006.01) H01L 23/29 (2006.01) H01L 23/31 (2006.01) C08L 63/00 (2006.01)
Patent
CA 2166043
Process for encapsulating an electronic component, in particular an integrated circuit, with an encapsulating material, at least comprising the steps of: - placing the component to be encapsulated in a cavity of a mould; - introducing the encapsulating material at elevated temperature into the cavity between the mould and the component to be encapsulated; - hardening the encapsulating material; and - releasing the encapsulated component from the cavity, the encapsulating material used comprising 40-65 % by weight of the engineering thermoplast and 60-35 % by weight of the reactive solvent.
Nelissen Johannes Gerard Lodewijk
Pas Ireneus Johannes Theodorus Maria
"3p" Licensing B.v.
Gowling Lafleur Henderson Llp
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