Process for etching epoxy resin with a high etch back value

C - Chemistry – Metallurgy – 08 – J

Patent

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Details

204/80, 149/12.1

C08J 7/14 (2006.01) C23C 18/22 (2006.01) H05K 3/00 (2006.01) H05K 3/46 (2006.01)

Patent

CA 1334924

The present invention relates to a process for etching epoxy resin with a high etch back value, in particular in the formation of drilled holes in circuit boards, using stable, highly alkaline permanganate etching solutions, and an apparatus for carrying out the process.

604860

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