B - Operations – Transporting – 23 – K
Patent
B - Operations, Transporting
23
K
113/90
B23K 1/08 (2006.01) B23K 1/00 (2006.01)
Patent
CA 1063442
P R O C E S S F O R F A B R I C A T I N G A H E A T E X C H A N G E R ABSTRACT OF THE DISCLOSURE An ultrasonic dip soldering process for bonding the tubular joints of a heat exchanger made up of tubular components joined together to form flow circuits within a fan coil. The joints are positioned adjacent to one of the tube sheets of the fan co 1 structure and the joints preheated by means of a remote heating process. The joints are then immersed in a molten bath of solder and treated to ultrasonic energy while in the bath.
273252
Carrier Corporation
Na
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