Process for flip chip connecting semiconductor chip

Details Process for flip chip connecting semiconductor chip Process for flip chip connecting semiconductor chip

H - Electricity

01

L

H01L 21/58 (2006.01) H01L 21/60 (2006.01) H01L 21/68 (2006.01) H01R 4/02 (2006.01) H05K 3/30 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2077406

A process for a flip chip connection is capable of improving the reliability of connection and the process can be easily practiced. The process comprises the steps of forming a plurality of stud bumps on the semiconductor chip, on which a plurality of solder bumps are formed, in the vicinity of the outer periphery thereof and outer side of the solder bumps, providing a cutting groove between a plurality of the solder bumps and the stud bumps, mating the solder bumps on the semiconductor chip and the corresponding solder bumps on the circuit board and heating for subsequent integration of the mating solder bumps, and breaking way the outer peripheral portion of the semiconductor chip along the cutting groove after a flip chip connection in order to remove the stud bumps.

Procédé pour effectuer la connexion d'une puce à protubérances, lequel procédé est facile à réaliser et permet d'augmenter la fiabilité de la connexion obtenue. Le procédé comporte les phases de formation d'une pluralité de pitons sur la puce du semi-conducteur sur lesquels une pluralité de protubérances de soudage sont formées, pratiquer une rainure de découpage entre les protubérances et les pitons près de la périphérie de celle-ci, faire correspondre les protubérances de soudage de la puce avec celles de la plaquette, appliquer de la chaleur pour obtenir la fusion des protubérances de soudage, détacher la portion périphérique de la puce le long de la rainure de découpage après la réalisation de la connexion.

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