Process for forming conductive through-holes through a...

Details Process for forming conductive through-holes through a... Process for forming conductive through-holes through a...

H - Electricity

05

K

356/16

H05K 3/42 (2006.01) H05K 3/40 (2006.01) H05K 3/00 (2006.01)

Patent

CA 1226373

TITLE PROCESS FOR FORMING CONDUCTIVE THROUGH-HOLES THROUGH A DIELECTRIC LAYER ABSTRACT A conductive through-hole hole is formed through a dielectric sandwiched between conductors by forming a noncircular hole in a conductor. etching a hole through the dielectric and by deforming at the conductor which has been undercut during the etching.

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