Process for forming silver conductors on a substrate

Details Process for forming silver conductors on a substrate Process for forming silver conductors on a substrate

H - Electricity

05

K

356/6

H05K 3/10 (2006.01) G03F 7/004 (2006.01) H05K 1/09 (2006.01) H05K 3/24 (2006.01) H05K 3/34 (2006.01)

Patent

CA 1249065

PROCESS FOR FORMING SILVER CONDUCTORS ON A SUBSTRATE Abstract of the Disclosure The invention provides a process for forming an electrical conductor pattern on desired areas of a substrate comprising the steps of applying a predetermined pattern of silver polymer ink on the substrate and at least partially curing it. A layer of silver solder paste is then applied over the cured polymer ink to a width larger than that of the ink. The solder paste is then reflowed and allowed to solidify, whereby the silver polymer ink becomes encapsulated in the reflowed silver solder to form the desired pattern of conductors which may then be covered with a layer of dielectric material comprising a cured non-conductive polymer ink. - i -

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