Process for high speed nickel and gold electroplate system

Details Process for high speed nickel and gold electroplate system Process for high speed nickel and gold electroplate system

C - Chemistry, Metallurgy

25

D

204/25

C25D 5/12 (2006.01) C25D 3/12 (2006.01) C25D 3/62 (2006.01)

Patent

CA 1162505

ABSTRACT OF THE DISCLOSURE Improved corrosion resistance of cobalt-hardened gold plating is achieved by the electrodeposition of a ductile, low-stress nickel coating on the substrate prior to the electrodeposition of the cobalt-hardened gold plating. The resulting plated substrate or workpiece is also described and claimed.

386447

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