Process for improving the adhesive strength of electrolessly...

Details Process for improving the adhesive strength of electrolessly... Process for improving the adhesive strength of electrolessly...

C - Chemistry, Metallurgy

23

C

117/75

C23C 18/30 (2006.01) H05K 1/03 (2006.01) H05K 3/18 (2006.01) H05K 3/38 (2006.01)

Patent

CA 1317824

Process for improving the adhesive strength of electro- lessly deposited metal layers on polyimide surfaces A b s t r a c t To improve the adhesive strength of electrolessly deposited metal deposits on surfaces of polyimide moulded bodies, the latter are treated with an activator formula- tion which, in addition to solvents, fillers and organo- metallic activators, preferably contains 5 - 25 % of a poly- imide as binder. Le A 25 735

586555

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