C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
C23C 18/18 (2006.01) C23C 18/30 (2006.01) H05K 3/18 (2006.01) H05K 3/38 (2006.01)
Patent
CA 2092159
Electrolessly deposited metal films having improved adhesion can be obtained by coating the surface of the substrates to be metallised with a formulation con- sisting of UV-curable varnishes which contain noble metal compounds as activators and, in addition, either fillers or solvents or a combination of fillers and solvents, curing these varnishes by means of UV radiation, followed by electroless metallisation of the substrates thus treated.
Giesecke Henning
Haese Wilfried
Wolf Gerhard-Dieter
Aktiengesellschaft Bayer
Fetherstonhaugh & Co.
I. & T. Innovation Technology Entwicklungs- Und Holding Aktienge
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