Process for improving the adhesiveness of electrolessly...

C - Chemistry – Metallurgy – 23 – C

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C23C 18/18 (2006.01) C23C 18/30 (2006.01) H05K 3/18 (2006.01) H05K 3/38 (2006.01)

Patent

CA 2092159

Electrolessly deposited metal films having improved adhesion can be obtained by coating the surface of the substrates to be metallised with a formulation con- sisting of UV-curable varnishes which contain noble metal compounds as activators and, in addition, either fillers or solvents or a combination of fillers and solvents, curing these varnishes by means of UV radiation, followed by electroless metallisation of the substrates thus treated.

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