Process for improving the mechanical strength of bonds...

C - Chemistry – Metallurgy – 09 – J

Patent

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C09J 5/02 (2006.01)

Patent

CA 2651481

The invention concerns a method for improving mechanical strength of bondings between substrates when said bondings are made with an adhesive comprising a curable resin by chain polymerization, and in particular a resin curable under the effect of light or ionizing radiation. Said method is characterized in that it consists in grafting on the surface of the substrates, before they are contacted with the adhesive, groups capable of acting as chain transfer agents when said resin is being polymerized. The invention is useful for assembling structural, engine, passenger compartment or body work components in the aeronautic, space, railway, marine and automotive industries.

L'invention se rapporte à un procédé permettant d'améliorer la tenue mécanique de collages entre des substrats lorsque ces collages sont réalisés au moyen d'un adhésif qui comprend une résine durcissable par polymérisation en chaîne, et en particulier une résine durcissable sous l'effet d'un rayonnement lumineux ou ionisant. Ce procédé est caractérisé en ce qu'il comprend le greffage sur la surface des substrats, avant que ceux-ci ne soient mis en contact avec l'adhésif, de groupes aptes à servir d'agents de transfert de chaîne lors de la polymérisation de ladite résine. Applications : assemblages de pièces de structure, de moteur, d'habitacle ou de carrosserie dans les industries aéronautique, spatiale, ferroviaire, navale et automobile.

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