Process for in-situ modification of solder composition

Details Process for in-situ modification of solder composition Process for in-situ modification of solder composition

B - Operations, Transporting

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B23K 35/26 (2006.01) B23K 35/36 (2006.01) H01L 23/485 (2006.01) H01L 23/488 (2006.01) H05K 3/34 (2006.01)

Patent

CA 1122856

PROCESS FOR IN-SITU MODIFICATION OF SOLDER COMPOSITION Abstract Extraction of non-lead components (e.g. tin, indium, etc.) from solder joints with monocarboxylic acids of alkylated hydrophenanthrene nuclei to increase the lead content of the solder joints. FI9-78-003

332645

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