Process for joining silicon nitride based ceramic bodies

Details Process for joining silicon nitride based ceramic bodies Process for joining silicon nitride based ceramic bodies

B - Operations, Transporting

23

P

26/150, 13/22

B23P 15/02 (2006.01) B21K 3/00 (2006.01) B23K 35/28 (2006.01) B23P 15/04 (2006.01) C04B 37/00 (2006.01)

Patent

CA 1147538

ABSTRACT OF THE DISCLOSURE A method of joining silicon nitride based ceramic bodies is disclosed. At least one interfacing surface of shaped bodies (one or both of which may be hot-pressed or reaction-sintered) receives a layer of metallic aluminum based material. the bodies with the metallic aluminum based material therebetween are subjected to beating at 1400-1900°C for a period typically .5-2 hours in a nitriding atmosphere to effect a chemical bond consisting of A conversion of the interfacing ceramic to a Si-Al-O-N system.

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