B - Operations – Transporting – 41 – J
Patent
B - Operations, Transporting
41
J
B41J 2/16 (2006.01)
Patent
CA 2580086
A device surface of a substrate is dry-sprayed with a polymeric material (e.g., a photoresist) to provide a spray-coated layer on the surface of the substrate. The spray-coated layer has a thickness ranging from about 0.5 to about 20 microns. Flow features are formed (e.g., imaged and developed) in the spray-coated layer. A nozzle plate layer is applied to the spray-coated layer. The nozzle plate layer has a thickness ranging from about 5 to about 40 microns and contains nozzle holes formed therein to provide the micro-fluid ejection head structure.
Selon l'invention, on pulvérise à sec sur une surface de dispositif d'un substrat une matière polymère (p.ex., une photorésine) afin de former une couche de pulvérisation sur la surface du substrat. La couche de pulvérisation possède une épaisseur comprise entre environ 0,5 et environ 20 microns. On forme (p.ex., on met en image et on développe) des éléments d'écoulement dans la couche de pulvérisation. On applique une couche de plaque de buse sur la couche de pulvérisation. La couche de plaque de buse possède une épaisseur comprise entre environ 5 et environ 40 microns et est percée de trous d'éjection qui permettent d'obtenir la structure de tête d'éjection microfluidique de l'invention.
Bertelsen Craig M.
Hart Brian C.
Holt Gary A. Jr.
Weaver Sean T.
Williams Gary R.
Lexmark International Inc.
Smart & Biggar
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