Process for making electrically conductive patterns

Details Process for making electrically conductive patterns Process for making electrically conductive patterns

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B05D 1/36 (2006.01) B05D 3/02 (2006.01) B05D 5/12 (2006.01) C23C 24/08 (2006.01) G03F 7/28 (2006.01) H05K 1/09 (2006.01) H05K 3/10 (2006.01) H05K 1/03 (2006.01)

Patent

CA 2015095

GE-2008 ABSTRACT A process for making an electrically conductive pattern on a substrate comprising forming on the substrate a patterned adhesive layer that contains a supplementary element, applying a metal powder to the patterned adhesive layer and firing the patterned substrate to volatilize the adhesive layer and sinter the metal powder. This process can be used to make printed circuits on ceramic substrates which are useful in hybrid circuits, for example.

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