Process for making electrically conductive patterns

Details Process for making electrically conductive patterns Process for making electrically conductive patterns

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B05D 1/26 (2006.01) B05D 3/02 (2006.01) B05D 5/12 (2006.01) C23C 24/08 (2006.01) G03F 7/28 (2006.01) H05K 3/10 (2006.01) H05K 1/03 (2006.01) H05K 3/38 (2006.01)

Patent

CA 2015094

GE-2010 ABSTRACT A process for making an electrically conductive pattern on a substrate comprising forming a patterned adhesive layer on the substrate, applying a conductive metal powder to the adhesive layer, and in a second coating pass, applying a powder containing supplementary elements to the pattern. The patterned substrate is fired to volatilize the adhesive layer and sinter the powders. This process can be used to make printed circuits on ceramic substrates which are useful in hybrid circuits, for example.

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