C - Chemistry – Metallurgy – 09 – D
Patent
C - Chemistry, Metallurgy
09
D
117/196, 400/771
C09D 179/08 (2006.01) B05D 3/02 (2006.01) B05D 7/24 (2006.01) C08J 3/09 (2006.01) G03F 7/038 (2006.01) H05K 1/00 (2006.01) H05K 3/46 (2006.01)
Patent
CA 2037479
Abstract of the Invention A polyimide layer having a thickness greater than about 5 microns is formed on a substrate by coating a substrate with a solution of polymer and a solvent of the formula Image wherein R1 and R2 are independently a hydrogen, a C1 to C6 Image alkyl moiety, or a ; R5 is a C1 to C6 alkyl moiety; and R3 and R4 are independently hydrogen or a C1 to C6 alkyl moiety, and curing the resulting coated substrate.
Burgess Marvin J.
Fjare Douglas E.
Neuhaus Herbert J.
Roginski Robert T.
Wargowski David A.
Gowling Lafleur Henderson Llp
The Texas A&m University System
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